Aeneon by Qimonda announced availability of its DDR3-1600 Triple Channel Kits (CL9) with 3GB and 6GB for the new Core i7 processor and X58 chipset. The modules feature high speed at 1600 MHz at latency of CL-9 running at standard DDR3 voltage of 1.5V. The XTUNE DDR3 Triple Channel Kits are available worldwide in a new stylish packaging box from November 2008.

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Before you head out to grab a Core i7 system loaded with 6GB or 12GB of memories for your gaming needs today, we will check out if you really need that much and if it is better to invest your money to get a more powerful graphics card. This article is suited for those who will be buying a Core i7 system primarily for gaming. Using the Core i7 920 processor overclocked to 4GHz on ASUS Rampage II Extreme board loaded with Windows Vista 64 SP1, we will check out how the latest games out there such as Crysis Warhead and Far Cry 2 perform along with benchmarks like 3DMark Vantage and Tropics.

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Kingston is shipping select DDR3 and DDR2 HyperX® memory modules with new T1 heatspreaders. The taller heatspreaders utilize HyperX Thermal Xchange (HTX) technology to further diffuse heat buildup when overclocking. HTX technology is the latest innovation from Kingston’s engineers who are dedicated to building the fastest memory for enthusiasts who push system performance.

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Need to know how your Extreme (QX9650) fairs against the new Extreme - Intel's (Nehalem) Core i7 Extreme 965 Socket 1366. Is it a fair fight or a simple pushover. Read as we pit them against each other in a synthetic benchmark fight using 3DMark Vantage. And if that isn't juicy enough we will overclock the CPUs upto 4.0GHz.

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Kingston announced it is first to ship 2GHz memory in triple-channel configuration designed specifically for the new Intel-based X58 motherboards. Kingston’s HyperX DDR3 2GHz memory, available now, come in kits of three 1GB modules that are Intel XMP (Extreme Memory Profile) ready meeting the Core i7 1.65 volt platform recommendation. In addition to the top-of-the-line 2GHz, Kingston’s family of triple-channel kits includes 1866- and 1800MHz, and low-latency 1600- and 1375MHz speeds. Kingston ValueRAM kits of three are also available in 1333MHz and 1066MHz, in 1- and 2GB capacities.

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G.Skill today unveils a whole new 4GB (2GBx2) GT1 DDR3 series running at PC3-16,000, featuring the unique Thermaltake RamOrb heatsink design. The Thermaltake designed heatspreader features dedicated heatpipes to effectively draw away heat produced by high-speed DDR3 memory up to the cooling fan and fins.

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Shipping immediately in 2GB memory kits, the new HyperX PC3-16000 memory offers gaming enthusiasts Enhanced Performance Profile (EPP) ready memory with EPP profiles pre-programmed on the modules. Two Gigahertz is now the sweet spot for many benchmarking enthusiasts and Kingston’s new 2GHz HyperX DDR3 memory is fully tested at specified frequency and timing values so it’s ideal for anyone seeking to boost performance,” said Ann Bai, Product Manager of Memory Module, Kingston.

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A-DATA introduces the latest cooling solution for extreme performance X Series memory modules. A-DATA’s X Series version 2.0 includes 4 types of cooling solutions* - active cooling, passive cooling, water cooling, and liquid cooling. This product clocks at DDR3-1600 CL7-7-7-20 by 1.75V~1.85V and is available as 1GB x 2 and 2GB x 2 dual-channel kits. Recommended retail price: DDR3-1600X Ver2.0, 1GBx2 Kit: 250 USD (incl VAT.) and DDR3-1600X Ver2.0, 2GBx2 Kit: 400 USD (incl VAT.)

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Kingston today announced it is first to release high performance, ultra low-latency 800MHz notebook memory. The new HyperX mobile memory is a perfect fit for notebook users who want to boost system performance by replacing standard notebook memory with high performance modules that boot to the highest speed possible ― without adjusting system BIOS settings. Targeting new P45/Centrino 2 laptops, the 800MHz CL4 modules have two pre-programmed ultra low-latency profiles: DDR2-800 CL4-4-4-12 @1.8V and DDR2-667 CL3-4-4-10 @1.8V.

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Kingston today announced the launch of the low profile modules for the commitment to the society. The new low profile modules function exactly the same way, which is absolutely great news for the end users who can benefit from smaller systems and lower heat diffusivity. These modules follow JEDEC standard with less consumption of PCB board, about 40% less in height compared to the modules we see today.

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