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TSMC Unveiled 40nm Half-Node Process For CPU & GPUs
TSMC Unveiled 40nm Half-Node Process For CPU & GPUs
Written by Visionary and filed under News > Technology
Published on March 25, 2008, 12:17 am
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TSMC today unveiled the foundry’s first 40nm manufacturing process technology. The new node supports a performance-driven general purpose (40G) technology and a power-efficient low power (40LP) technology. The 45nm node provided double the gate density of 65nm, while the new 40nm node features manufacturing innovations that enable its LP and G processes to deliver a 2.35 raw gate density improvement of the 65nm offering. The transition from 45nm to 40nm low power technology reduces power scaling up to 15 percent. TSMC has developed the 40LP for leakage-sensitive applications such as wireless and portable devices and its 40G variant targeting performance applications including CPU, GPU, game console, networking and FPGA designs and other high-performance consumer devices. Read More >>